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Apr 18, 2022 · Chip On Glass (COG) is the method of placing the driver IC directly on top of the glass substrate. Chip On Film (COF) refers to a film with a thin printed circuit equipped with a driver IC, and this film connects the display substrate and the FPCB. As the driver IC is bonded to a thin film, the film can be rolled or folded, which allows a ...
COF is the abbreviation of Chip on Film, which is the technology of chip on film assembly in Chinese. COF is a flexible film with the ability to carry ICs and passive components by using the characteristics of the COG technology process, and in terms of flexibility, COF not only helps to enhance the functionality of products, high density of ...
underfill material, which enables filling the narrow spaces between the IC chip and the 2-layered chip without bubbles. The 2-layered tape also features easy installation onto CR parts and is flexible enough to bend freely. These features offer a promising advantage when this method is applied to compact appliances such as cellular phones and PDAs.
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Jun 1, 2000 · Chip-on-film (COF) is a new technology after tape-automated-bonding (TAB) and chip-on-glass (COG) in the interconnection of liquid crystal module (LCM). The thickness of the film, which is more ...
We developed a so-called "reel-to-reel method" COF technology using a long carrier tape for the LCD driver package. This method enables mass production of COF. We used the ILB (inner lead bonding) technique that connects inner leads on a 2-layered tape (glue-less) to Au bumps on an IC chip. COP tape material should be carefully selected with respect to both thermal expansion and heat ...
Jun 1, 2012 · Various fine pitch chip-on-film (COF) packages assembled by (1) anisotropic conductive film (ACF), (2) nonconductive film (NCF), and (3) AuSn metallurgical bonding methods using fine pitch flexible printed circuits (FPCs) with two-metal layers were investigated in terms of electrical characteristics, flip chip joint properties, peel adhesion strength, heat dissipation capability, and reliability.
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What is chip on film (COF)?
What is chip on film & chip on plastic?
What is chip-on-film (COF)?
What is a chip on glass (COG)?
What is flip chip bonding technology?
How to connect IC chips with cop tape?
Dec 1, 2001 · Chip-on-film or chip-on-flex (COF) is the fabrication technology that is currently applied in liquid crystal module (LCM) of small panel. COF is developed after the surface mount technology (SMT), tape-automated bonding (TAB), and chip-on-glass (COG) technology. The geometry of the COF is similar to that of TAB.
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