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  1. Additionally, copper alloys that possess exceptional resistance to radiation are utilized in space-grade printed circuit boards. Alloys such as copper-tungsten (CuW) and copper-molybdenum (CuMo) provide enhanced durability against degradation and embrittlement caused by radiation.

  2. High reliability and devices with space heritage are key factors in the selection of components for space level applications. NASA generally specifies Level 1, qualified manufacturer list Class V (QMLV) devices, and they will always ask if there is a higher quality level available.

    • Shaping
    • Electronic Assembly
    • Joining
    • Materials Processing
    • Surface Engineering

    The domain of shaping is wide ranging and includes topics, such as advanced forming, spin forming, incremental flow forming, magnetic pulse forming, near net shape and precision casting. However, by far the most dominant technology to be developed in this area is that of additive manufacturing (3D printing). Additive manufacturing has the potential...

    The miniaturization of the circuit in Printed Circuit Boards (PCBs) is generally named High Density Interconnect (HDI) technology, which enables more functions per unit area. It specifically requires various advanced manufacturing processes, materials and test methods, and it can lead to newly discovered failure mechanisms, which need to be assesse...

    Joining and welding are considered to be core technologies for the space industry and are widely used. The most common techniques include Tungsten Inert Gas and Metal Inert Gas, both manual and automated, and Laser and Electron Beam welding. With the advent of additive manufacturing, coupled with the introduction of non-metallic materials such as C...

    Materials processing encompasses a number of different manufacturing technologies including composite materials, ceramics and powder metallurgy. It also includes process improvements to enhance demisability of spacecraft as well as the fabrication of biomimetic designs. As an example of composite manufacturing, Out of Autoclave (OOA) processing is ...

    The domain of surface engineering includes the preparation and cleaning of surfaces, the modification of surfaces using techniques, such as laser shock peening and nano-texturing as well as the development of corrosion protection systems. Materials obsolescence, particularly in the area of surface engineering, is becoming an increasingly significan...

  3. Photolithography (also known as optical lithography) is a process used in the manufacturing of integrated circuits. It involves using light to transfer a pattern onto a substrate, typically a silicon wafer. The process begins with a photosensitive material, called a photoresist, being applied to the substrate.

  4. Analog Devices has been supporting the aerospace and defense markets for over 40 years with high reliability devices. Areas of focus are electronic warfare, radar, communications, avionics, unmanned systems, and missile and smart munitions applications. Today’s focus is on the space market.

  5. www.nasa.gov › smallsat-institute › sst-soa7.0 Thermal Control - NASA

    Jul 2, 2010 · Thermal control of a spacecraft is achieved by balancing the energy as shown in Equation 1. q solar + q albedo + q planetshine + Q gen = Q stored + Q out,rad (1) Q gen (heat generated by the spacecraft) depends on the power dissipation of spacecraft components.

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  7. Sep 27, 2023 · This allows CubeSat projects to be readied for flight extremely quickly – typically within one or two years. CubeSats are now commonly used in low-Earth orbit for applications such as remote sensing, space weather measurements and communications.

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